失效模式 - 修定 ( Telcordia SR-332 Issue 3 )

Telcordia在2008年底所公布的SR-332 Issue 3 修定方向如下：

Issues that have been raised by the user community since the publication of Issue 2, which can potentially be addressed in Issue 3, include:
自从Issue 2出版后，使用者社群所提出的问题里，可能在Issue 3中被提出来作修订的包含下列项目

‧        Use of operating temperature for temperature effects on failure rate estimation,
‧        操作温度的使用，调整温度效应在失效率预估的影响
‧        Adjustment of failure rate estimates for RoHS compliance,
‧        调整通过RoHS承认组件的失效率
‧        Adjustment of failure rate estimates for surface mount technology,
‧        调整了SMT组件的失效率
‧        Adjustment of failure rates for derating,
‧        调整降额使用的失效率
‧        Revision of temperature and stress curve assignments for generic devices, and
‧        修订通用装置在温度与应力曲线的分配
‧        Revision of environmental factors in failure rate estimation.
‧        修订失效率预估中的环境因子